Sonics and CoWare Expand Strategic Partnership to Accelerate Industry-Wide SystemC Platform SoC Transformation; CoWare to Distribute Sonics Inc.(R) SMART Interconnects(TM) Solutions to ESL Designers
MOUNTAIN VIEW, Calif. & SAN JOSE, Calif.—(BUSINESS WIRE)—April 7, 2006—
Sonics Inc., the premier supplier of system-on-chip
(SoC) SMART Interconnects solutions, and CoWare(R) Inc., the leading
supplier of platform-driven electronic system-level (ESL) design
software and services, announced a broad agreement by which CoWare
will distribute SystemC language versions of Sonics SMART
Interconnects solutions that operate seamlessly in CoWare's
platform-driven ESL design environment.
Platform-driven ESL design refers to the development and practical
reuse of a SystemC transaction-level model (TLM) of a system-on-chip
(SoC) platform throughout the system design process for architectural
exploration, early software development, and system verification. The
collaboration between Sonics and CoWare addresses this growing trend
by adding the Sonics models to the CoWare Model Library for use in
CoWare Platform Architect for TLM platform capture and analysis. The
joint solution will also provide direct links from CoWare Platform
Architect to the SMART Interconnects solutions available at the
register-transfer level from Sonics. The combination provides
geographically dispersed engineering teams with a powerful design and
implementation solution that bridges multiple abstraction levels,
speeds system verification, and enables software development to begin
sooner in the development cycle.
"The fusion of advanced SystemC-based architectural modeling and
software development, with flexible interconnect technology, is a
major advancement that will accelerate the transformation to platform
SoC architectures," said Phil Casini, vice president marketing, Sonics
Inc. "CoWare and Sonics, the pioneers in these areas, are perfect
partners to drive this transformation."
The Joint Solution
For ESL platform design, CoWare will sell and distribute IEEE 1666
SystemC-based versions of the Sonics SMART Interconnects solutions
that are compatible with its Platform Architect environment. CoWare
will also sell and distribute a new ESL design version of
SonicsStudio(TM), a tool used to configure the SystemC models of
Sonics SMART Interconnects solutions. This provides customers with
one-stop shopping through CoWare for all SystemC development needs.
A fully-featured version of SonicsStudio, available from Sonics,
can then use the same SystemC model configuration data developed in
the Platform Architect environment to create a Verilog HDL version
complete with synthesis scripts and an advanced verification test
bench, guaranteeing a rapid transition from architectural exploration
into logical and physical design.
"Adding the Sonics models to the CoWare Model Library enhances our
ability to provide the industry with the best ESL environment
available. We are excited to partner with Sonics," said Tim Smith,
vice president world-wide sales, CoWare, Inc.
Availability
Sonics SMART Interconnects models will be available from CoWare as
a part of the CoWare Model Library in July 2006. For more information,
contact the CoWare sales office nearest you.
About Sonics
Sonics, Inc.(R) is the premier supplier of SMART Interconnects(TM)
solutions that deliver high SoC design predictability and increased
design efficiency. Major semiconductor and systems companies including
Broadcom, Samsung, Texas Instruments and Toshiba have applied Sonics'
SMART Interconnects solutions in leading products in the wireless,
digital multimedia and communications markets. Sonics is a
privately-held company funded by Cadence Design Systems, Toshiba
Corporation, Samsung Ventures, and venture capital firms Investar
Capital, Smart Technology Ventures, TL Ventures, Easton Hunt Capital,
JAFCO Ventures, and H&Q Asia-Pacific. For more information, see
www.sonicsinc.com
About CoWare
CoWare is the leading supplier of platform-driven system-level
electronic design automation (EDA) software tools and services. CoWare
offers a comprehensive set of electronic system-level (ESL) tools that
enable SoC developers to "differentiate by design" through the
creation of system-IP including embedded processors, on-chip buses,
and DSP algorithms; the architecture of optimized SoC
platforms;hardware/software co-design; and virtual platforms for
software development. The company's solutions are based on open
industry standards including SystemC. CoWare's customers are major
systems, semiconductor, and IP companies in the market where consumer
electronics, computing, and communications converge. CoWare's
corporate investors include ARM ((LSE:ARM);(Nasdaq:ARMHY)), Cadence
Design Systems (NYSE:CDN), STMicroelectronics (NYSE:STM), and Sony
Corporation (NYSE:SNE). CoWare is headquartered in San Jose, Calif.,
and has offices around the world. For more information about CoWare
and its products and services, visit http://www.coware.com.
Sonics and SMART Interconnects are registered trademarks of
Sonics, Inc. All other trademarks are the property of their respective
owners. CoWare is a registered trademark of CoWare, Inc. All other
trademarks are the property of their respective owners.
Contact:
CoWare, Inc.
Mindy Palmer, 408-392-8513
Email Contact
or
Fast Forward PR (for Sonics)
Mary Jane Reiter, 408-725-1239
Email Contact
or
Armstrong Kendall, Inc. (for CoWare)
Jean Armstrong, 503-672-4680
Email Contact
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